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Specification differences for GD32F103C8T6, STM32F103C8T6
Parameter
Operating temperature--40°C ~ 85°C (TA)
Supply voltage2.6V – 3.6V (Direct 3.3V match)-
Voltage - Supply (vcc (vdd))-2V ~ 3.6V
Memory & Peripherals64 KB Flash, 20 KB SRAM; 2x SPI, 2x I2C, 3x USART, 1x USB 2.0 FS, 1x CAN 2.0B-
Program Memory Size-64KB (64K x 8)
Program Memory Type-FLASH
Ram Size-20K x 8
CaseLQFP-4848-LQFP
Package-Tray
Compatibility Level100% Drop-in (Zero Code Change)-
Connectivity-CANbus, I²C, IrDA, LINbus, SPI, UART/USART, USB
Core & ArchitectureARM Cortex-M3 @ 108 MHz (vs ST @ 72 MHz)-
Core Processor-ARM® Cortex®-M3
Core Size-32-Bit Single-Core
Data Converters-A/D 10x12b
Firmware NotesDirect binary drop-in for standard 72MHz configurations. When recompiling from source, install the GigaDevice GD32F10x DFP pack in Keil/IAR for full 108MHz zero-wait-state Flash performance. Flash programming algorithms differ: ensure SWD programmers (J-Link / ST-Link) support GD32 Flash algorithm.-
Hardware NotesExact 1:1 pin layout. Power decoupling caps (100nF on VDD/VSS pins) and crystal oscillator load caps (8MHz external) are identical. No PCB rev required.-
Lead Time AdvantageShenzhen Spot Stock (24–48h Dispatch)-
Mounting-Surface Mount
Number Of I (o)-37
Oscillator Type-Internal
Peripherals-DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Reference PartSTM32F103C8T6-
Series-STM32F1
Sourcing AdvantageMillions of units in continuous Shenzhen warehouse circulation. Shipped in original factory tape & reel or moisture-barrier dry-packs.-
Speed-72MHz

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