Winbond DDR1/DDR2/LPDDR parts are entering last-time-buy as major suppliers shift capacity to HBM and DDR5. This guide h...

Q4 2026 procurement playbook for high-density SPI NOR and serial NAND: China's 28nm 2Gb NOR debut, Winbond's Kaohsiung e...

SK Hynix CEO confirmed August 27, 2026 that the memory crunch runs through 2030. DDR5 +486% from 2025 base. Infineon SEM...

The White House is reportedly weighing a Section 232 expansion that would end the AI data center exemption and apply chi...

Apple asked CXMT for a DRAM discount and was quoted Samsung prices — a structural signal that changes the buyer calculus...

Sony's ¥747B TSMC joint venture puts a 2029 production start on next-gen image sensors — AI camera buyers face a supply ...

NAND contract prices are up more than 100% in the first half of 2026, with eMMC and UFS parts now the hidden bottleneck ...

DDR3 and DDR2 memory is disappearing from open market as HBM allocation pulls DRAM capacity toward AI chips. Here is wha...

Winbond customers sign 2030 LTAs as NOR flash lead times exceed 40 weeks. Check live Winbond W25Q and W29N stock in the ...