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Analog Devices MAX9762EUI — Analog & Data Acquisition

MAX9762EUI Class AB Audio Amp, 3W x 2 @ 3Ω, 28-TSSOP

MPNMAX9762EUI
End of Life

Maxim Integrated MAX9762EUI Class AB stereo audio power amplifier, 2-channel (stereo) with stereo headphones, 3W x 2 @ 3Ohm, 28-TSSOP (0.173", 4.40mm Width) Exposed Pad, Surface Mount.

$3.33Ref. price · indicative, final on quote
Packaging28-TSSOP (0.173", 4.40mm Width) Exposed Pad
RoHSRoHS non-compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MAX9762EUI specifications
ParameterValue
TypeClass AB
Output type2-Channel (Stereo) with Stereo Headphones
MountingSurface Mount
Voltage4.5V ~ 5.5V
Max output power x channels @ load3W x 2 @ 3Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
Case28-TSSOP (0.173\", 4.40mm Width) Exposed Pad

Product details

Active production — BOM-fit note

The MAX9762EUI: RoHS non-compliant — the part contains lead (Pb) above the exemption threshold, which matters for EU RoHS-required BOMs or end-equipment shipped into restricted markets.

3 W per channel into 3 Ω — what that means for the load

Rated 3 W x 2 into a 3 Ω load from a 5 V supply — this is the continuous sine-wave output before clipping, not a peak or burst rating. The 3 Ω figure is lower than the common 4 Ω or 8 Ω speaker impedance, so the amplifier delivers higher current per channel than a typical 8 Ω-rated part at the same supply voltage. Class AB topology means the output stage biases into conduction across the full waveform, avoiding the crossover distortion of Class B while running cooler than a pure Class A stage. The trade-off is quiescent current draw — budget the idle current into the 5 V rail when sizing the supply.

Package and thermal interface

28-TSSOP with exposed pad (EP) — the die-attach paddle on the underside of the package must be soldered to a PCB copper plane to pull heat out of the 3 W output stage. Without a thermal via array under the pad, the junction temperature rises above the 85 °C ambient limit at full output. The exposed pad is the main thermal path — the plastic TSSOP body alone cannot dissipate the 2–3 W of heat from both channels driven simultaneously. Layout should connect the EP to a ground plane with at least four thermal vias.

Frequently asked questions

Is MAX9762EUI a direct replacement for MAX9762?

The MAX9762EUI is the 28-TSSOP-EP package variant of the MAX9762 family. The base MAX9762 is available in other packages (e.g., 28-TQFN). Pin compatibility depends on the specific package — the TSSOP-EP footprint differs from the TQFN, so a board layout change is required when swapping between package options.