Current sense amplifier for precision monitoring
It senses current via an external shunt resistor and outputs a voltage proportional to the load current.
The 5-UCSP package is a wafer-level chip-scale package — no plastic overmold, so it handles thermal cycling well but is sensitive to board flex and moisture. Plan for a controlled soldering profile and conformal coating if the assembly sees condensation.
No end-of-life notice or last-time-buy schedule is in effect.
