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Analog Devices MAX399EGE — Discrete Semiconductors

MAX399EGE Analog Devices SP4T Mux, 2-Circuit, 16-QFN

MPNMAX399EGE
End of Life

Analog Devices MAX399EGE precision dual 4-channel analog multiplexer, SP4T switch circuit, 100 Ohm on-resistance, 16-VQFN Exposed Pad package, surface mount.

$1.07Ref. price · indicative, final on quote
Packaging16-VQFN Exposed Pad
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MAX399EGE specifications
ParameterValue
MountingSurface Mount
Voltage - supply, dual (V±)±3V ~ 8V
Voltage - supply, single (V+)3V ~ 15V
Current - leakage (IS(off))100pA
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
Crosstalk-92dB @ 100kHz
Case16-VQFN Exposed Pad
Switch circuitSP4T
Charge injection2pC
Number of circuits2
On-State resistance100Ohm
Switch time (Ton, toff)150ns, 150ns
Multiplexer (Demultiplexer circuit)4:1
Channel capacitance (CS(off), CD(off))11pF, 20pF
Channel-to-Channel matching (ΔRon)6Ohm (Max)

Product details

What the -92 dB crosstalk actually means for your signal chain

The MAX399EGE is a precision dual 4:1 multiplexer (two independent SP4T switches) from Analog Devices' MAX399 family. Its -92 dB crosstalk at 100 kHz means that when you are switching a 1 Vpp signal on channel 1, less than 250 µV of that signal bleeds into channel 2 at the same frequency. For a 16-bit ADC with a 5 V reference, that is well below 1 LSB of interference — the mux does not limit your system's noise floor in most precision analog front-ends. The 100 Ohm max on-resistance tells you the series resistance the signal sees when the channel is closed. Driving a 10 kOhm load, the voltage error from Ron is about 1%. For a 1 kOhm load, it is a 10% divider — you need a buffer amplifier after the mux for low-impedance loads. The 6 Ohm channel-to-channel matching means the Ron difference between any two channels is at most 6 Ohms, which keeps gain errors consistent across channels in a multiplexed system.

Supply flexibility — single or dual rails

The total supply span is the same either way — 6 V to 16 V. With dual rails, the analog signal can swing symmetrically around ground, which is useful for bipolar sensor signals like thermocouple outputs or strain-gauge bridges. On a single rail, the signal must be biased above ground to stay within the common-mode range. The 150 ns max switch time (both Ton and Toff) means the mux settles fast enough for audio-frequency scanning and low-speed data acquisition. At 1 MHz switching, the 150 ns transition is 15% of the period — fine for muxing before a SAR ADC that samples at 100 kSPS. Not fast enough for video or RF switching, where sub-10 ns parts are needed.

Package and temperature — board-fit reality

The MAX399EGE comes in a 16-VQFN with exposed pad, 4 mm x 4 mm body (supplier device package 16-QFN). The part is rated for the full range, so no derating needed for factory-floor enclosures or outdoor telecom cabinets. Not qualified for under-hood automotive (that would need -40°C to +125°C and AEC-Q100).

Active production — sourcing posture

The package is listed as Bulk delivery — this is the shipping format (tubes or trays), not a package type. The actual IC package is the 16-VQFN Exposed Pad described above. Bulk packaging is typical for engineering samples and low-volume production runs; for high-volume tape-and-reel, check the -TR suffix variant if available.

Frequently asked questions

What is the charge injection spec and why does it matter?

The MAX399EGE has a charge injection of 2 pC typical. This is the amount of charge dumped onto the signal path when the switch transitions from on to off or vice versa. For a 10 nF sampling capacitor on the output of the mux, 2 pC creates a 200 µV glitch. At 12-bit resolution with a 5 V reference (1.22 mV LSB), that glitch is about 1/6 of an LSB — negligible for most applications. For 16-bit systems with a 5 V reference (76 µV LSB), the glitch is about 2.6 LSBs and may need a sample-and-hold settling delay after the mux switches before the ADC conversion starts.

What is the leakage current and how does it affect high-impedance inputs?

The MAX399EGE has a maximum off-channel leakage current of 100 pA. For a 10 MOhm source impedance, 100 pA creates a 1 mV offset voltage across the source resistance. For a 100 MOhm source (like a pH probe or photodiode amplifier), the offset is 10 mV — significant at 16-bit levels. The leakage doubles roughly every 10°C above 25°C, so at 85°C the worst-case leakage could be around 1.6 nA, creating a 16 mV offset into a 10 MOhm source. Plan your input buffer accordingly if the source impedance is above 1 MOhm.