Package and rework considerations
The 24-TQFN (4x4 mm) with exposed pad is a standard QFN footprint. The exposed pad is the primary thermal path and also the ground return for the high-speed RF path — it needs a solid via array under the pad to the ground plane. Rework is manageable with hot air if the board has a solder dam around the pad; the part is small enough that the pad wicks heat quickly.
Lifecycle and sourcing posture
ROHS3 compliant. There is no official second-source or pin-compatible alternate from another manufacturer at this data rate — the part is proprietary to Maxim (now Analog Devices). For BOM resilience, the active status means it can be specified into new designs without immediate LTB risk.