Package and board-fit for the 16-TQFN
The MAX17270ETE+T: The exposed paddle on the bottom side must be soldered to a thermal land on the PCB to achieve the rated thermal performance; a 4-layer board with vias under the pad is the standard layout. Surface-mount only — no through-hole variant. The tape-and-reel or cut-tape packaging suits both prototype assembly and volume pick-and-place.
Conversion topology and output flexibility
This is a buck-boost regulator (step-up/step-down) with three programmable outputs. Total output current is 1.2 A shared across the three outputs. Synchronous rectification is built in, which keeps efficiency above 90% across most of the load range — no external Schottky diode needed.
Temperature grade and deployment environment
This covers most portable, IoT, and industrial sensor nodes that operate indoors or in sheltered outdoor enclosures. Output configuration is positive — the regulator generates positive rails only. No inverting topology support.