Temperature range and deployment environment
Rated for operation from -40°C to 125°C junction temperature. AEC-Q100 qualification covers thermal cycling, high-temperature operating life, and electrostatic discharge tests.
Package and thermal management
Housed in a 16-TSSOP with exposed pad (16-TSSOP-EP), the package provides a low thermal resistance path to the PCB ground plane. The exposed pad must be soldered to a thermal land and connected to the ground plane with thermal vias to keep the junction temperature within limits when driving external MOSFETs at high switching frequencies. The surface-mount footprint is standard for TSSOP-16, with the exposed pad adding a central thermal land that pick-and-place machines handle without special tooling.
Sourcing and lifecycle
ROHS3 compliant. No official replacement or second-source alternate is listed; for dual-sourcing resilience, qualify the part directly with Maxim.