Thermal and package considerations
The exposed pad on the 16-TSSOP package must be soldered to a PCB copper plane to keep junction temperature within the -40°C to 125°C range at full 600mA load. The pad is on the bottom of the package; a thermal via array under the pad is standard practice. The part is surface-mount only — no through-hole option.
Lifecycle and sourcing
The MAX16904RAUE33/V+ is listed as Active on the manufacturer's lifecycle status. It is ROHS3 compliant. The part is available through independent distribution and is quoted to order against an RFQ — current pricing and lead time are confirmed at quote time.