RoHS compliance boundary — legacy exemption or Pb-free restriction
The CMP02BICP is marked RoHS non-compliant. This means the device contains lead (Pb) in the solder-dip termination finish or die-attach material above the 0.1% threshold, and no RoHS exemption is claimed on this date code. For a BOM that mandates Pb-free per EU RoHS 2011/65/EU, this part does not pass — it is suited for military, aerospace, or industrial applications that carry an explicit lead exemption in the procurement spec, or for repair depots that stock tin-lead solder.
