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Analog Devices ADXL354BEZ-RL — Analog & Data Acquisition

ADXL354BEZ-RL Analog Devices

MPNADXL354BEZ-RL
End of Life

Analog Devices ADXL354BEZ-RL, 3-axis analog MEMS accelerometer, ±2g/±4g selectable range, 400 mV/g sensitivity at ±2g, 1.5 kHz bandwidth, 14-CLCC package, tape and reel.

$70.86Ref. price · indicative, final on quote
Packaging14-CLCC
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ADXL354BEZ-RL specifications
ParameterValue
TypeAnalog
Output typeAnalog Voltage
MountingSurface Mount
Voltage2.25V ~ 3.6V
Operating temperature-40°C ~ 125°C (TA)
Bandwidth1.5kHz
AxisX, Y, Z
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesStandby Mode
Case14-CLCC
Acceleration range±2g, 4g
Sensitivity (mV (g))400 (±2g) ~ 200 (±4g)

Product details

Three-axis analog output with selectable range

The ADXL354BEZ-RL is a 3-axis (X, Y, Z) MEMS accelerometer with analog voltage output, covering ±2g and ±4g full-scale ranges selectable via a logic pin. At the ±2g setting the sensitivity is 400 mV/g; switching to ±4g halves it to 200 mV/g, so the output span stays within the same 0.1 V to 2.9 V window for either range. Bandwidth is 1.5 kHz, which covers mechanical vibration monitoring up to the first few harmonics of a 50 Hz line or a 60 Hz motor shaft without aliasing into the measurement band. The analog output feeds directly into a SAR ADC or an op-amp front-end — no digital protocol latency. The standby mode drops quiescent current to microamp levels for battery-powered logging between measurement bursts.

14-CLCC package — rework and board integration

Housed in a 14-lead ceramic leadless chip carrier (14-CLCC) measuring 6 mm × 6 mm, the package has a gold-plated ceramic base and a metal lid. The leads are on a 1.27 mm pitch around the perimeter — visible and probe-accessible after reflow, unlike a QFN with hidden pads under the body. For hand rework: preheat the board to 125°C, then hit the package with a hot-air nozzle at 300°C for 20-30 seconds. The ceramic body soaks heat evenly, so the solder on all 14 joints reflows at about the same moment. The tape-and-reel format suits automated pick-and-place; the ceramic lid is hermetic, so no moisture sensitivity level (MSL) bake is required before reflow — the part can sit on the shelf indefinitely.

The ceramic package keeps the die stress-isolated from the board, so the zero-g offset drift over temperature stays within the datasheet limits — no plastic-package hysteresis at the hot end. Product status is Active with ROHS3 compliance.

Frequently asked questions

What is the difference between ADXL354BEZ-RL and ADXL354BEZ-RL7?

The ADXL354BEZ-RL and ADXL354BEZ-RL7 share the same die, axis configuration, acceleration range (±2g/±4g), sensitivity, bandwidth, and package. The only difference is the reel quantity — the -RL suffix is a standard 7-inch reel, while the -RL7 variant is a 13-inch reel. They are functionally identical and drop into the same board layout.