The 2 nA input bias current and 200 µV input offset voltage are adequate for general-purpose work.
Package and mounting — through-hole matters
The 8-DIP (0.300-inch, 7.62 mm pitch) through-hole package is the breadboard-friendly form factor. It fits standard DIP sockets and perfboard, which makes it a natural choice for prototyping, lab builds, or legacy designs that avoid surface-mount assembly. The 8-PDIP supplier device package is the same physical outline.
