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Winbond Electronics W25N512GV Series

24 variants · Winbond Electronics

About the Winbond Electronics W25N512GV Series

The Winbond Electronics W25N512GV Series series groups 24 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common frequency of 166 MHz, memory format of FLASH and memory interface of SPI - Quad I/O. Variants differ by case, operating temperature and package, so you can match the exact case your application requires using the selection guide below.

Select a variant by

Case
8-WDFN Exposed Pad · 16-SOIC (0.295\", 7.50mm Width) · 24-TBGA
Operating temperature
-40°C ~ 85°C (TA) · -40°C~85°C(TA)
Package
Tape & Reel (TR) · Tray · Tube
Access time
6 ns · 7 ns

Shared specifications

Frequency
166 MHz
Memory format
FLASH
Memory interface
SPI - Quad I/O
Memory organization
64M x 8
Memory size
512Mbit
Memory type
Non-Volatile
Mounting
Surface Mount
Technology
FLASH - NAND (SLC)
Voltage
2.7V ~ 3.6V
Write cycle time - word, page
700µs

Variant comparison

ParameterW25N512GVEIGW25N512GVBIGW25N512GVBIG TRW25N512GVBIT TRW25N512GVEIG TRW25N512GVEIR
Case8-WDFN Exposed Pad24-TBGA24-TBGA24-TBGA8-WDFN Exposed Pad8-WDFN Exposed Pad
Operating temperature-40°C~85°C(TA)-40°C~85°C(TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C~85°C(TA)
PackageTubeTrayTape & Reel (TR)Tape & Reel (TR)Tape & Reel (TR)Tray
Access time7 ns6 ns6 ns6 ns6 ns

Request a quote on any Winbond Electronics W25N512GV Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants