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Winbond Electronics W25M Series

42 variants · Winbond Electronics

About the Winbond Electronics W25M Series

The Winbond Electronics W25M Series series groups 42 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common frequency of 104 MHz, memory format of FLASH and memory interface of SPI - Quad I/O. Variants differ by case, operating temperature and package, so you can match the exact case your application requires using the selection guide below.

Select a variant by

Case
8-WDFN Exposed Pad · 24-TBGA
Operating temperature
-40°C ~ 85°C (TA) · -40°C~85°C(TA)
Package
Tape & Reel (TR) · Tray · Tube
Voltage
1.7V ~ 1.95V · 2.7V ~ 3.6V
Access time
7 ns · 8 ns

Shared specifications

Frequency
104 MHz
Memory format
FLASH
Memory interface
SPI - Quad I/O
Memory organization
256M x 8
Memory size
2Gbit
Memory type
Non-Volatile
Mounting
Surface Mount
Technology
FLASH - NAND (SLC)
Write cycle time - word, page
700µs

Variant comparison

ParameterW25M02GWZEIGW25M02GVTBIGW25M02GVTCIGW25M02GWTBIGW25M02GWTBIG TRW25M02GWTBIT
Case8-WDFN Exposed Pad24-TBGA24-TBGA24-TBGA24-TBGA24-TBGA
Operating temperature-40°C~85°C(TA)-40°C ~ 85°C (TA)-40°C~85°C(TA)-40°C~85°C(TA)-40°C~85°C(TA)-40°C ~ 85°C (TA)
PackageTubeTrayTrayTrayTape & Reel (TR)Tray
Voltage1.7V ~ 1.95V2.7V ~ 3.6V2.7V ~ 3.6V1.7V ~ 1.95V1.7V ~ 1.95V1.7V ~ 1.95V
Access time7 ns7 ns8 ns8 ns8 ns

Request a quote on any Winbond Electronics W25M Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants