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Toshiba Semiconductor and Storage TLP250H Series

12 variants · Toshiba Semiconductor and Storage

About the Toshiba Semiconductor and Storage TLP250H Series

The Toshiba Semiconductor and Storage TLP250H Series series groups 12 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common channels of 1, common mode transient immunity of 40kV/µs and data rate of -. Variants differ by case, current - DC forward (If) and current - output (Channel), so you can match the exact case your application requires using the selection guide below. All listed Toshiba Semiconductor and Storage TLP250H Series part numbers are active and orderable.

Select a variant by

Case
8-DIP (0.300\", 7.62mm) · 8-SMD, Gull Wing
Current - DC forward (If)
5mA · 20mA
Current - output (Channel)
2 A · 2.5 A
Mounting
Surface Mount · Through Hole
Operating temperature
-40°C ~ 125°C · -40°C~125°C
Package
Tape & Reel (TR) · Tape & Reel (TR) Cut Tape (CT) · Tube

Shared specifications

Channels
1
Common mode transient immunity
40kV/µs
Data rate
-
Input type
DC
Inputs - side 1/Side 2
1/0
Output type
Push-Pull, Totem Pole
Propagation delay tpLH (tpHL)
500ns, 500ns
Rise (Fall time)
50ns, 50ns
Voltage
10V ~ 30V
Voltage - forward (Vf)
1.57V
Voltage - isolation
3750Vrms

Variant comparison

ParameterTLP250H(D4-TP1,F)TLP250H(TP1,F)TLP250H(D4,F)TLP250H(D4-LF1,F)TLP250H(F)TLP250HF(D4,F)
Case8-SMD, Gull Wing8-SMD, Gull Wing8-DIP (0.300\", 7.62mm)8-SMD, Gull Wing8-DIP (0.300\", 7.62mm)8-DIP (0.300\", 7.62mm)
Current - DC forward (If)20mA20mA20mA20mA20mA5mA
Current - output (Channel)2.5 A2.5 A2.5 A2.5 A2.5 A2 A
MountingSurface MountSurface MountThrough HoleSurface MountThrough HoleThrough Hole
Operating temperature-40°C ~ 125°C-40°C ~ 125°C-40°C~125°C-40°C ~ 125°C-40°C ~ 125°C-40°C~125°C
PackageTape & Reel (TR) Cut Tape (CT)Tape & Reel (TR) Cut Tape (CT)TubeTubeTubeTube

Request a quote on any Toshiba Semiconductor and Storage TLP250H Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants