
TI MSP430F67791AIPEUR Microcontroller, 25MHz, 512KB Flash, 128-LQFP
Texas Instruments MSP430F6xx series, 16-bit microcontroller, 25MHz MSP430 CPUXV2, 512KB Flash, 32KB RAM, 7x24b sigma-delta converters, 8x10b ADC, I2C/SPI/UART/IrDA/LINbus, 90 I/O, 128-LQFP (20x14mm), -40°C to 85°C, 1.8V to 3.6V, surface mount, Tape & Reel / Cut Tape.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | MSP430F6xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 25MHz |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| RAM size | 32K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter |
| Connectivity | I²C, IrDA, LINbus, SPI, UART/USART |
| Number of i (O) | 90 |
| Core processor | MSP430 CPUXV2 |
| Case | 128-LQFP |
| Data converters | A/D 8x10b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
What is the thermal derating situation at 60 °C ambient panel temperature?
The MSP430F67791AIPEUR is rated to -40°C to 85°C TA. At 60 °C ambient you have 25 °C of headroom, which is within standard industrial derating practice for this grade. However, the 25MHz operation and 512KB Flash do not carry an explicit thermal resistance in this dataset — a junction-temperature model is the defensible step before BOM freeze if the board is in a sealed enclosure without forced airflow.
What is the lead pitch and body size of the 128-LQFP?
The MSP430F67791AIPEUR uses a 128-lead LQFP with 0.5mm lead pitch and a 20×14mm body (supplier device package listed as 128-LQFP (20x14)). This matches the standard TI MSP430F6xx 128-pin LQFP land pattern, confirmed drop-fit for existing carrier boards with the same pin count.
How do I verify authenticity before committing surplus stock to a BOM?
For a part at eol_hot lifecycle stage, sourcing through independent traders without TI CofC trace is the primary counterfeit ingress risk on a 512KB Flash device. A CofC from authorised distribution against the TI manufacturing date code is the minimum verification step; full flash-integrity and DMA-channel functional test is the defensible gate before production use of any lot-sourced part.