STM32F469NIH6 MCU — 180MHz Cortex-M4, 2MB Flash, 216-TFBGA
STMicroelectronics STM32F4 series, 32-bit ARM Cortex-M4 single-core MCU, 180MHz, 2MB Flash, 384KB SRAM, 161 I/O, 216-TFBGA (13×13 mm) tray, -40°C to 85°C, 1.7–3.6 V supply.
Specifications
| Parameter | Value |
|---|---|
| Series | STM32F4 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.7V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 180MHz |
| Package | Tray |
| RAM size | 384K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SAI, SDIO, SPI, UART/USART, USB, USB OTG |
| Number of i (O) | 161 |
| Core processor | ARM® Cortex®-M4 |
| Case | 216-TFBGA |
| Data converters | A/D 24x12b; D/A 2x12b |
| Program memory size | 2MB (2M x 8) |
Frequently asked questions
Can the 216-TFBGA be assembled with standard SAC305 solder paste?
Yes. The 216-TFBGA follows the standard MSL-3 paste profile — Sn96.5Ag3Cu0.5 with a 260°C peak is within the normal assembly window. The -40°C cold-start rating is a storage and handling spec, not a reflow input constraint. X-ray inspection after reflow is mandatory on BGA assemblies at this ball count.
What is the lead time and how should I source this part?
With an eol_hot designation, lead times through authorized channels are being managed against remaining distributor stock. An RFQ will surface current allocation status, lot traceability, and whether tray quantities in the 10–100 range are available. Do not source this part from independent brokers without traceability documentation — BGA authenticity and moisture-preg history are the two failure modes that kill boards in production.