STM32F469AIY6TR — STM32F4 180MHz WLCSP168 MCU, 2MB Flash, EOL-Hot
STMicroelectronics STM32F4 series, 32-bit ARM Cortex-M4 MCU running at 180MHz, 2MB Flash, 384KB RAM, 168-UFBGA WLCSP package on tape and reel. 114 GPIO, Ethernet, USB OTG, 24-channel 12-bit ADC plus 2-channel 12-bit DAC, 1.7V–3.6V supply, -40°C to 85°C operating temperature.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | STM32F4 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.7V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 180MHz |
| Package | Tape & Reel (TR) |
| RAM size | 384K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SAI, SDIO, SPI, UART/USART, USB, USB OTG |
| Number of i (O) | 114 |
| Core processor | ARM® Cortex®-M4 |
| Case | 168-UFBGA, WLCSP |
| Data converters | A/D 24x12b; D/A 2x12b |
| Program memory size | 2MB (2M x 8) |
Frequently asked questions
Can I use the same CubeIDE HAL firmware on the STM32F469AIY6TR as I use on the STM32F469NI LQFP variant?
ST's HAL layer is die-portable across packages within the same part number base — the STM32F469AIY6TR and STM32F469NI share the same silicon. However, the 114 GPIO count on the WLCSP maps to different physical ball locations than the LQFP pinout, so any direct GPIO register assignments or board-level pin definitions in the firmware will need remapping. HAL initialization for peripherals (Ethernet, USB OTG, ADC, timers) carries across packages without modification.
The WLCSP168 package is listed at -40°C to 85°C — does that rating cover standard SAC305 reflow assembly?
The -40°C to 85°C rating is an ambient operating limit, not a reflow profile specification. Standard SAC305 reflow profiles reach a peak of 260°C, which is a peak temperature exposure rather than a sustained operating condition. WLCSP packages are moisture-sensitive and the assembly house must apply the correct MSL derating and soak times per IPC/JEDEC standards. Confirm with your contract manufacturer that the WLCSP168 package is listed on their qualified board-assembly profile before releasing the part to a panel build.