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Renesas Electronics 71V547S100PFGI — Microcontrollers & Processors (MCU / MPU / DSP)

71V547S100PFGI ZBT SRAM, 4.5 Mbit, 10 ns, 100-TQFP

MPN71V547S100PFGI
End of Life

SRAM - Synchronous, SDR (ZBT), 4.5 Mbit (128K x 36), Parallel interface, 10 ns access, 3.135V-3.465V, -40°C to 85°C, 100-LQFP (14x14), Bulk.

$4.08Ref. price · indicative, final on quote
Packaging100-LQFP
StockIn Stock (25)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

71V547S100PFGI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage3.135V ~ 3.465V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
TechnologySRAM - Synchronous, SDR (ZBT)
Access time10 ns
Memory size4.5Mbit
Memory formatSRAM
Case100-LQFP
Memory organization128K x 36

Product details

ZBT pipeline and bus efficiency

The 71V547S100PFGI is a 4.5 Mbit synchronous SRAM organized 128K x 36, using Zero Bus Turnaround (ZBT) technology to eliminate the dead cycle between read and write operations on a shared data bus. This matters when the memory shares the bus with other peripherals — a ZBT pipeline keeps the bus saturated at the clock rate, unlike standard synchronous SRAM that inserts a turnaround cycle. With a 10 ns access time, the part supports bus clocks up to 100 MHz in a single-cycle read/write regime. The 36-bit wide word matches a 32-bit data path plus parity or ECC bits without needing a second device.

Supply and temperature envelope

A standard 3.3 V LDO with 1 % initial accuracy and 50 mV dropout margin covers it. The 100-TQFP (14x14 mm) package has a 0.5 mm pitch — a 4-layer PCB with solid ground and power planes under the body is recommended to keep the thermal gradient across the die below 10°C.

It is available through authorized and independent distribution channels; pricing and lead time are confirmed at RFQ against the BOM quantity. Bulk packaging means the parts ship in tubes or trays, not tape-and-reel. This is typical for prototype runs and low-volume production where a reel minimum is uneconomical. The date-code spread on a bulk lot is usually tighter than a reel split across multiple production weeks.

Frequently asked questions

What is the memory organization and interface of 71V547S100PFGI?

It is organized as 128K words by 36 bits (4.5 Mbit total) with a parallel synchronous interface using Zero Bus Turnaround (ZBT) technology. The 36-bit word width suits a 32-bit data bus plus four parity/ECC bits.

What package does 71V547S100PFGI come in?

The supplier device package designation is 100-TQFP (14x14).