Military temperature grade and hermetic package
The 71256S85DB: Housed in a 28-pin ceramic DIP (CDIP-28, 0.600-inch body width), the hermetic package seals the die against moisture and outgassing — a requirement for sealed electronics in vacuum or high-humidity environments where plastic packages risk popcorn cracking or ionic contamination.
85 ns access time and 5 V parallel interface
Organised as 32K x 8 bits (256 Kbit total), the parallel interface presents a byte-wide data bus — the address and data lines connect directly to a microcontroller or FPGA memory controller without serialisation overhead.