NXP MKL04Z8VLC4 MCU — 48MHz ARM Cortex-M0+, 8KB Flash, 32-LQFP, -40 to 105°C
NXP Kinetis KL0, MKL04Z8VLC4, 48MHz ARM Cortex-M0+ 32-bit MCU; 8KB Flash, 1KB RAM; 28 I/O, 14x12b ADC, I²C/SPI/UART; 1.71–3.6V; 32-LQFP (7x7mm); -40°C to 105°C TA; tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications
| Parameter | Value |
|---|---|
| Series | Kinetis KL0 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 48MHz |
| Package | Tray |
| RAM size | 1K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT |
| Connectivity | I²C, SPI, UART/USART |
| Number of i (O) | 28 |
| Core processor | ARM® Cortex®-M0+ |
| Case | 32-LQFP |
| Data converters | A/D 14x12b |
| Program memory size | 8KB (8K x 8) |
Frequently asked questions
Is the MKL04Z8VLC4 pin-compatible with other KL04 variants like the MKL04Z32?
Both are KL04 Z-series parts in 32-LQFP, but the Z8 carries 8KB Flash and 1KB RAM versus the Z32's larger memory map. They share the same package footprint, but firmware built against the Z32's linker file will not map directly to the Z8 — a re-addressing pass is required.
With only 1K x 8 RAM and one UART, can the MKL04Z8VLC4 handle simultaneous HMI and Modbus RTU traffic at 115200 baud?
Simultaneous dual-channel serial requires time-division multiplexing on the single UART, which becomes tight at 115200 baud under active traffic. Low-throughput Modbus RTU exchanges can share the port with an HMI if the polling cycle is light, but an external UART expander or a KL variant with additional UART instances is the safer choice for concurrent dual-role designs.
What does the -40°C to 105°C TA rating mean for a sealed IP54 panel with no active cooling?
The 105°C ambient limit applies at the device level; in a sealed panel without forced airflow, board-level and on-die junction temperatures will run hotter than ambient. Specific derating factors for 3.3V supply current at the 105°C corner and whether external I/O MOSFETs are needed depend on load current per pin and thermal resistance of the 32-LQFP — these should be confirmed against the NXP thermal resistance data for the 32-LQFP (7x7mm) package.