Package and mounting — wettable flank for AOI
The 32-HVQFN (5x5 mm) package uses a wettable flank design, which means the side of the package has a solderable surface. That lets automated optical inspection (AOI) verify the solder joint after reflow — a practical advantage for high-volume assembly or any board where a hidden QFN pad is a reliability concern. The exposed pad underneath also helps thermal transfer if the MCU is driving I/O near its current limits.
