LPC55S16JBD64E

NXP USA Inc.

NXP LPC55S1x series, ARM Cortex-M33 32-bit single-core MCU, 150 MHz, 256 KB Flash, 96 KB RAM, CAN, USB, Flexcomm, 1.8-3.6 V, 64-HTQFP exposed pad, -40 to 105 °C.

NXP USA Inc. LPC55S16JBD64E
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[IN STOCK] In Stock: 1 pcs
$11.97/ pc

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Technical specifications

LPC55S16JBD64E specifications
Parameter / AttributeSpecification / Value
SeriesLPC55S1x
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed150MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)36
Core processorARM® Cortex®-M33
Case64-TQFP Exposed Pad
Data convertersA/D 10x16b SAR
Program memory size256KB (256K x 8)

Technical details

NXP LPC55S16JBD64E is a 32-bit ARM Cortex-M33 single-core microcontroller from the LPC55S1x series, clocked at 150 MHz.

150 MHz Cortex-M33 — what the speed buys

The 150 MHz Cortex-M33 core handles real-time control loops and protocol stacks (USB, CAN). TrustZone isolates a secure bootloader without a second chip.

Memory and connectivity — fitting the BOM

256 KB Flash and 96 KB RAM support a moderate firmware image with a real-time OS, a USB stack, and a CANopen node. The Flexcomm interface can be reconfigured as an additional SPI, I²C, or UART — useful when the board needs one more serial port than the dedicated pins provide. The 10-channel 16-bit SAR ADC covers analog sensing without an external converter. Watch the 36 I/O count against your pin budget; the 64-HTQFP exposed pad helps thermal dissipation if the MCU drives multiple peripherals continuously.

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