LPC5516JBD64E

NXP USA Inc. · LPC551x Series

NXP LPC551x series, LPC5516JBD64E, 32-bit ARM Cortex-M33 single-core MCU, 150 MHz, 256 KB Flash, 96 KB RAM, CANbus / USB / SPI / I2C / UART, 10-ch 16b SAR ADC, 36 GPIO, 1.8–3.6 V supply, -40 to 105°C, 64-HTQFP (10×10 mm) exposed pad, tray.

NXP USA Inc. LPC5516JBD64E
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[IN STOCK] In Stock: 16 pcs
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Technical specifications

LPC5516JBD64E specifications
Parameter / AttributeSpecification / Value
SeriesLPC551x
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed150MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)36
Core processorARM® Cortex®-M33
Case64-TQFP Exposed Pad
Data convertersA/D 10x16b SAR
Program memory size256KB (256K x 8)

Technical details

150 MHz Cortex-M33 with 256 KB Flash — mid-range industrial MCU

The NXP LPC5516JBD64E is a 32-bit ARM Cortex-M33 single-core microcontroller running at 150 MHz, with 256 KB of Flash program memory and 96 KB of SRAM. It sits in the LPC551x series, positioned for real-time control and communication tasks that need a balance of processing throughput and peripheral integration — motor drives, industrial fieldbus gateways, and sensor fusion nodes. The Cortex-M33 core includes a single-cycle multiply-accumulate unit and hardware divide, plus optional TrustZone for security-sensitive code isolation. Operating temperature range is -40 to 105°C.

Connectivity includes CANbus, Flexcomm (configurable as SPI, I²C, or UART/USART), and full-speed USB. I²S and PWM are also on-chip. The 36 GPIO pins are available on the 64-HTQFP package, which has an exposed pad for thermal dissipation.

The part is ROHS3 compliant.

LPC5516JBD64E
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