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NXP USA Inc. LPC5516JBD64E — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC5516JBD64E — ARM Cortex-M33 MCU, 150MHz, 256KB Flash, 64-HTQFP

MPNLPC5516JBD64E
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NXP LPC5516JBD64E, LPC551x series, ARM Cortex-M33 single-core at 150MHz, 256KB Flash, 96KB RAM, CANbus / USB / SPI / I2C / UART, 10-ch 16b SAR ADC, 36 GPIO, 1.8–3.6 V supply, -40 to 105°C, 64-HTQFP (10×10mm) exposed pad, tray.

$7.9300Ref. price · indicative, final on quote
Packaging64-TQFP Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LPC5516JBD64E Technical Specifications
ParameterValue
SeriesLPC551x
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed150MHz
PackageTray
RAM size96K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)36
Core processorARM® Cortex®-M33
Case64-TQFP Exposed Pad
Data convertersA/D 10x16b SAR
Program memory size256KB (256K x 8)

Frequently asked questions

What is the worst-case junction temperature at 100% CPU load, and does the enclosure need a heatsink?

The operating temperature is rated -40 to 105 °C ambient (TA). The 64-HTQFP exposed thermal pad is the primary heat-removal path; no thermal resistance figure appears in the listed ratings. Junction temperature at 100% CPU load requires thermal modelling against the actual board and enclosure — a thermal pad or heatsink is application-dependent and not decided by the spec table alone.

Can I map CAN, USB OTG, 2× SPI, 2× I2C, and 10 ADC channels simultaneously on 36 GPIO?

Channel multiplexing forces pin-sharing across the 36 GPIO. The 10 ADC channels and the fixed CAN and USB pins consume a significant share of available pins before any Flexcomm remapping is considered. Whether all listed peripherals can run simultaneously without dropping one requires consulting the NXP pin multiplexing table — it cannot be confirmed from the listed ratings alone.