NXP LPC18xx ARM Cortex-M3 32-bit single-core MCU, LPC1810FBD144,551, 180MHz, 136K x 8 SRAM, ROMless, 2.2–3.6V supply, 144-LQFP (20x20mm) Tray, 83 I/O, -40°C to 85°C, CAN, EBI/EMI, SPI, I²C, UART, 8x10b ADC, 1x10b DAC.
| Parameter | Value |
|---|---|
| Series | LPC18xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | ROMless |
| Voltage - supply (Vcc (Vdd)) | 2.2V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 180MHz |
| Package | Tray |
| RAM size | 136K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 83 |
| Core processor | ARM® Cortex®-M3 |
| Case | 144-LQFP |
| Data converters | A/D 8x10b; D/A 1x10b |
Includes CANbus controller, EBI/EMI, I²C, SPI, UART, SD/MMC — 83 GPIOs in 144-LQFP. 8-channel 10-bit ADC and single 10-bit DAC.
ROMless — code executes from external memory via EBI/EMI. 136KB SRAM for heap and buffers. 144-LQFP (20x20mm) package.
Yes, the LPC1810FBD144,551 includes a CANbus controller as part of its connectivity peripherals, alongside EBI/EMI, I²C, SPI, UART, and SD/MMC interfaces.
The LPC1810FBD144,551 runs at 180MHz, which is the maximum clock speed for this ARM Cortex-M3 core in the LPC18xx series.
The operating temperature range is -40°C to 85°C, suitable for industrial and outdoor telecom environments.
The LPC1810FBD144,551 and LPC1788 are both ARM Cortex-M3 MCUs from NXP, but they are not pin-compatible — the LPC1788 uses a different package and peripheral set. They are not direct replacements without PCB redesign.