24C02C-E/P
Microchip Technology
Tube-40°C~125°C(TA)EEPROM
Ref. price$0.5400
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Microchip Technology 24C02 Series
3 variants · Microchip Technology
About the Microchip Technology 24C02 Series
ICBOMS is a China IC distributor and semiconductor supplier — an independent, Shenzhen-based overseas procurement agent for Microchip Technology 24C02 Series components — sourcing Microchip Technology 24C02 Series parts new and original only, across the authorized and vetted independent channel, with every lot authenticity-screened before shipment. The Microchip Technology 24C02 Series series groups 3 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common case of 8-DIP (0.300\", 7.62mm), memory format of EEPROM and memory interface of I²C. Variants differ by access time, clock frequency and operating temperature, so you can match the exact access time your application requires using the selection guide below. All listed Microchip Technology 24C02 Series part numbers are active and orderable.
Select a variant by
- Access time
- 3.5 µs · 900 ns
- Clock frequency
- 100 kHz · 400 kHz
- Operating temperature
- -40°C~125°C(TA) · 0°C~70°C(TA)
- Package
- Bulk · Tube
- Write cycle time - word, page
- 1.5ms · 5ms
Shared specifications
- Case
- 8-DIP (0.300\", 7.62mm)
- Memory format
- EEPROM
- Memory interface
- I²C
- Memory organization
- 256 x 8
- Memory size
- 2Kbit
- Memory type
- Non-Volatile
- Mounting
- Through Hole
- Supply voltage
- 4.5V ~ 5.5V
- Technology
- EEPROM
Variant comparison
| Parameter | 24C02C-E/P | 24C02A-E/P | 24C02/P |
|---|---|---|---|
| Access time | 3.5 µs | 3.5 µs | 900 ns |
| Clock frequency | 100 kHz | 100 kHz | 400 kHz |
| Operating temperature | -40°C~125°C(TA) | -40°C~125°C(TA) | 0°C~70°C(TA) |
| Package | Tube | Bulk | Bulk |
| Write cycle time - word, page | 1.5ms | 1.5ms | 5ms |
Request a quote on any Microchip Technology 24C02 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
