Molded tantalum construction and temperature range
ESR and ripple handling at 100 kHz
Stay below that for long life.
Package footprint and board layout
1411 (3528 Metric) package, size code B — 3.50 mm x 2.80 mm footprint, 2.10 mm seated height. The molded case has no exposed cathode tab, so the thermal path goes through the solder pads. Keep the copper pad area generous under each termination to pull heat into the board.
This is a current-design part suitable for new builds. No pin-compatible second source listed, but the TPS series covers a range of capacitance and voltage combinations in the same footprint.
