TLE4929CXHAM18NHAMA1
Infineon Technologies
Through HoleTape & Reel (TR); Cut Tape (CT)-40°C ~ 175°C (TJ)
Ref. price$5.94
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Infineon Technologies TLE4 Dc Dc Modules Series
6 variants · Infineon Technologies
About the Infineon Technologies TLE4 Dc Dc Modules Series
The Infineon Technologies TLE4 Dc Dc Modules Series series groups 6 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common package of Tape & Reel (TR); Cut Tape (CT) and technology of Hall Effect. Variants differ by case, current - supply and features, so you can match the exact case your application requires using the selection guide below.
Select a variant by
- Case
- 3-SIP Module · SOT-23-6 Thin, TSOT-23-6 · TO-236-3, SC-59, SOT-23-3
- Current - supply
- 2.5mA · 13.4mA · 130nA
- Features
- Programmable · Programmable, Temperature Compensated · Temperature Compensated
- Mounting
- Surface Mount · Through Hole
- Operating temperature
- -40°C ~ 125°C (TJ) · -40°C ~ 170°C (TJ) · -40°C ~ 175°C (TJ)
- Output type
- I²C · Open Drain
- Sensing distance
- ±120mT · ±160mT · 2.25mT Trip, -2.25mT Release
- Voltage
- 2.8V ~ 3.5V · 3V ~ 32V · 4V ~ 16V
Shared specifications
- Package
- Tape & Reel (TR); Cut Tape (CT)
- Technology
- Hall Effect
Variant comparison
| Parameter | TLE4929CXHAM18NHAMA1 | TLE493DP2B6A3HTSA1 | TLE49681MXTSA1 |
|---|---|---|---|
| Case | 3-SIP Module | SOT-23-6 Thin, TSOT-23-6 | TO-236-3, SC-59, SOT-23-3 |
| Current - supply | 13.4mA | 130nA | 2.5mA |
| Features | Programmable, Temperature Compensated | Programmable | Temperature Compensated |
| Mounting | Through Hole | Surface Mount | Surface Mount |
| Operating temperature | -40°C ~ 175°C (TJ) | -40°C ~ 125°C (TJ) | -40°C ~ 170°C (TJ) |
| Output type | Open Drain | I²C | Open Drain |
| Sensing distance | ±120mT | ±160mT | 2.25mT Trip, -2.25mT Release |
| Voltage | 4V ~ 16V | 2.8V ~ 3.5V | 3V ~ 32V |
Request a quote on any Infineon Technologies TLE4 Dc Dc Modules Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
