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Infineon Technologies CY7C25632KV18-550BZXI — Memory (DRAM / SRAM / Flash / EEPROM)
Infineon Technologies

Infineon CY7C25632KV18-550BZXI QDR II+ SRAM, 72Mbit, 550 MHz

MPNCY7C25632KV18-550BZXI
End of Life

Infineon CY7C25632KV18-550BZXI, QDR II+ synchronous SRAM, 72Mbit, 550 MHz clock, parallel interface, 4M x 18 organization, 1.7V–1.9V VDDQ, -40°C to 85°C, 165-FBGA (13x15mm), Tray.

$355.5400Ref. price · indicative, final on quote
CY7C25632KV18-550BZXI datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C25632KV18-550BZXI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency550 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

Industrial temperature grade

Rated for -40°C to 85°C ambient, the BZXI suffix covers outdoor telecom cabinets and factory-floor control enclosures where the commercial-grade CY7C25632KV18-550BZC (0°C to 70°C) would risk timing margin above 70°C. If the BOM targets an unconditioned environment, this is the variant to lock in.

Sourcing and lifecycle posture

Infineon lists this part as Active, meaning the manufacturer continues to accept new orders and support production builds. No last-time-buy window is announced. For volume commitments, this part is sourced and quoted to order through independent distribution — availability and current pricing confirmed at quote time. The 165-FBGA (13x15 mm) footprint matches the commercial-temperature BZC variant, so a qualification swap between the two is a BOM-line change, not a board respin.

Frequently asked questions

Will CY7C25632KV18-550BZXI drop into a board designed for CY7C25632KV18-550BZC?

Yes, both share the same 165-FBGA (13x15 mm) package and pinout. The BZXI variant adds the -40°C to 85°C industrial temperature range; the BZC is 0°C to 70°C. No board respin needed for the swap.

What is the closest functional second-source for CY7C25632KV18-550BZXI?

The CY7C25632KV18-400BZXI is the same density and organization but runs at 400 MHz. For a full-speed drop-in, the CY7C25632KV18-550BZC is pin-compatible but commercial-temperature only. No exact second-source from another manufacturer is listed.