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Infineon Technologies CY7C1570KV18-500BZC — Memory (DRAM / SRAM / Flash / EEPROM)
Infineon Technologies

CY7C1570KV18-500BZC 72Mbit DDR II+ SRAM, 500 MHz

MPNCY7C1570KV18-500BZC
End of Life

Infineon CY7C1570KV18-500BZC, 72Mbit synchronous DDR II+ SRAM, 2M × 36 organization, 500 MHz clock frequency, 1.7 V–1.9 V supply, 165-ball FBGA (13 × 15 mm) tray, 0 °C–70 °C operating temperature.

$282.24Ref. price · indicative, final on quote
CY7C1570KV18-500BZC datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1570KV18-500BZC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency500 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit DDR II+ SRAM at 500 MHz — what it means for the bus

The Infineon CY7C1570KV18-500BZC is a 72 Mbit synchronous DDR II+ SRAM organized 2M × 36, clocked at 500 MHz. It runs on a 1.7 V to 1.9 V core supply and is specified over the 0 °C to 70 °C commercial temperature range.

165-ball FBGA — rework and layout notes

The 165-ball FBGA package measures 13 × 15 mm. That is a mid-size BGA — not tiny, but dense enough that hand rework needs a pre-heated bottom zone and a controlled hot-air nozzle. The ball pitch is not listed here, but the footprint is standard for this generation of Infineon synchronous SRAM; verify the ball map against your PCB layout before committing. Surface-mount only, tray delivery.

Frequently asked questions

What is the closest functional second-source for the CY7C1570KV18-500BZC?

The CY7C1570KV18-500BZXC is the same die in bulk packing instead of tray — functionally identical at 500 MHz, 72 Mbit, 2M × 36. Not a second manufacturer, but a drop-in for the same socket if your assembly line can handle bulk tubes.

Will the CY7C1570KV18-500BZC drop into a board designed for the CY7C1570KV18-500BZXC?

Yes — the two parts share the same die, same 165-ball FBGA footprint, same 500 MHz timing, and same 0 °C to 70 °C temperature range. The only difference is the shipping medium: tray (BZC) vs bulk (BZXC). No rewiring or PCB change needed.