GeneSiC Semiconductor GD60 Series

2 variants · GeneSiC Semiconductor

About the GeneSiC Semiconductor GD60 Series

The GeneSiC Semiconductor GD60 Series series groups 2 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common case of TO-247-2, mounting of Through Hole and operating temperature - junction of -55°C ~ 175°C. Variants differ by capacitance @ vr,, current - average rectified and current - reverse leakage @ vr, so you can match the exact capacitance @ vr, your application requires using the selection guide below. All listed GeneSiC Semiconductor GD60 Series part numbers are active and orderable.

Select a variant by

Capacitance @ vr,: 1.463nF @ 1V, 1MHz · 4577pF @ 1V, 1MHz
Current - average rectified: 82A · 122A
Current - reverse leakage @ vr: 10 µA @ 650 V · 40 µA @ 1700 V
Speed: Fast Recovery =< 500ns, > 200mA (Io) · No Recovery Time > 500mA (Io)
Voltage - DC reverse (Vr): 650 V · 1700 V

Shared specifications

Case: TO-247-2
Mounting: Through Hole
Operating temperature - junction: -55°C ~ 175°C
Package: Tube
Voltage - forward (Vf) (Max) @ if: 1.8 V @ 60 A

Variant comparison

Parameter	GD60MPS17H	GD60MPS06H
Capacitance @ vr,	4577pF @ 1V, 1MHz	1.463nF @ 1V, 1MHz
Current - average rectified	122A	82A
Current - reverse leakage @ vr	40 µA @ 1700 V	10 µA @ 650 V
Speed	Fast Recovery =< 500ns, > 200mA (Io)	No Recovery Time > 500mA (Io)
Voltage - DC reverse (Vr)	1700 V	650 V

Request a quote on any GeneSiC Semiconductor GD60 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.