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Everspin Technologies Inc. — Signal Isolation

Everspin Technologies Inc. Signal Isolation — 17 part numbers with specifications and datasheets. Filter by key specs and request a quote on ICBOMS.

Memory Organization
64K x 16 · 128K x 16 · 32K x 8 · 512K x 8
Memory Size
1Mbit · 2Mbit · 256Kbit · 4Mbit
Supplier Device Package
44-TSOP2 · 8-DFN (5x6) · 48-FBGA (8x8) · 48-FBGA (10x10)
Operating Temperature
-40°C ~ 85°C (TA) · -40°C ~ 105°C (TA) · 0°C ~ 70°C (TA) · -40°C ~ 125°C (TA)
Package / Case
44-TSOP (0.400", 10.16mm Width) · 8-VDFN Exposed Pad · 48-LFBGA · 54-TSOP (0.400", 10.16mm Width)
Memory Interface
Parallel · SPI
Voltage - Supply
3V ~ 3.6V · 2.7V ~ 3.6V

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