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Cypress Semiconductor Corp CY7C2270KV18-550BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C2270KV18-550BZXI 36Mbit SRAM, 550 MHz

MPNCY7C2270KV18-550BZXI
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Cypress CY7C2270KV18-550BZXI, 36Mbit synchronous SRAM, DDR II+ parallel interface, 550 MHz clock, 1.7–1.9 V supply, 1M x 36 organization, -40°C to 85°C operating temperature, 165-FBGA (13×15) surface-mount package.

$93.2800Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C2270KV18-550BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency550 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
TechnologySRAM - Synchronous, DDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

550 MHz DDR II+ SRAM for high-throughput line cards

The Cypress CY7C2270KV18-550BZXI is a 36Mbit synchronous SRAM using a DDR II+ parallel interface, clocked at 550 MHz. Organized as 1M x 36, it operates from -40 to 85 °C and comes in a 165-FBGA (13x15 mm) package.

What the 550 MHz clock buys you

At 550 MHz, the DDR II+ interface transfers data on both clock edges. The 1.7 to 1.9 V core supply keeps I/O power reasonable for dense memory arrays.

Frequently asked questions

What is the closest functional second-source for CY7C2270KV18-550BZXI?

The CY7C2270XV18-600BZXC is a pin-compatible sibling with a 600 MHz clock speed, but it is rated for commercial temperature (0 to 70 °C) only. It will drop into the same PCB footprint and supply voltage, but verify your thermal environment before substituting for an industrial-temperature design.

What package does CY7C2270KV18-550BZXI come in?

It is supplied in a 165-ball FBGA (13x15 mm) package, surface-mount only. The listing shows the packaging form as Bulk, meaning loose trays rather than tape-and-reel.