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Cypress Semiconductor Corp CY7C2263XV18-600BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C2263XV18-600BZXC 36Mbit QDR II+ SRAM, 600 MHz

MPNCY7C2263XV18-600BZXC
Active

Infineon (Cypress) CY7C2263XV18-600BZXC, 36Mbit synchronous QDR II+ SRAM, 600 MHz, 1.7–1.9 V, 165-FBGA (13×15), 2M × 18, surface mount, 0°C to 70°C.

$110.9200Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C2263XV18-600BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency600 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Product details

The QDR II+ interface eliminates bus-turnaround dead cycles by dedicating separate read and write ports, so back-to-back transactions at full clock rate are possible — critical for high-throughput networking buffers, line cards, and DSP pipelines that cannot tolerate wait states. Organized as 2M x 18, it matches 18-bit-wide data paths common in switch fabrics and FFT engines.

That means indoor, climate-controlled equipment: central-office telecom, data-center switches, test-and-measurement racks. Not suited for a motor-drive cabinet or an outdoor base station without active cooling. If your BOM calls for industrial or automotive temperature, this is the wrong part.

165-ball FBGA, 13 x 15 mm body. Bulk packaging (trays).

Listed as Active.

Frequently asked questions

Will CY7C2263XV18-600BZXC drop into a board designed for CY7C2268XV18-600BZXC without rewiring?

Yes — both share the same 165-FBGA footprint, 2M x 18 organization, 1.7–1.9 V supply, and commercial temperature range. The only difference is the clock speed: 600 MHz on this part versus 633 MHz on the CY7C2268XV18-633BZXC. No layout change is needed.

What is the package type for CY7C2263XV18-600BZXC?

It ships in Bulk (tray) packaging, in a 165-ball FBGA measuring 13 x 15 mm.