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Cypress Semiconductor Corp CY7C1564XV18-450BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1564XV18-450BZXC 72Mbit QDR II+ SRAM, 450 MHz

MPNCY7C1564XV18-450BZXC
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Infineon CY7C1564XV18-450BZXC, QDR II+ synchronous SRAM, 72 Mbit organized 2M x 36, 450 MHz clock, parallel interface, 1.7 V–1.9 V supply, 165-FBGA (13x15 mm), commercial temperature 0°C to 70°C.

$225.3700Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1564XV18-450BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency450 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit QDR II+ SRAM at 450 MHz — what it delivers on the bus

The 450 MHz clock rate yields a peak data bandwidth that suits high-throughput applications like network packet buffers, switch fabric lookup tables, and test equipment waveform memory. The separate read and write data ports eliminate bus-turnaround dead cycles, keeping the pipeline full on back-to-back transactions.

450 MHz — timing margin and the board's 1.8 V rail

At 450 MHz the data valid window is tight.

Commercial temperature — indoor, not industrial

It is not rated for outdoor telecom cabinets, factory floor motor drives, or engine-bay electronics where ambient temperatures exceed 70°C.

The 2M x 36 organization and 450 MHz clock rate are the primary fit gates for a BOM line; the 165-FBGA footprint and 1.7 V to 1.9 V supply rail must match the existing PCB layout and power design.

Frequently asked questions

What is the closest functional second-source for CY7C1564XV18-450BZXC?

The CY7C1570KV18-500BZC is a close functional peer with the same 72 Mbit density, 2M x 36 organization, and 1.7 V supply, but it runs at 500 MHz instead of 450 MHz. The 50 MHz delta changes the timing closure target and may require a board respin to exploit the higher speed.

What package does CY7C1564XV18-450BZXC use?

The part is supplied in a 165-ball FBGA package measuring 13x15 mm, surface-mount only.

What technology is CY7C1564XV18-450BZXC?

It is a synchronous SRAM using the QDR II+ architecture, a volatile memory with separate read and write ports for zero bus-turnaround overhead.

Will CY7C1564XV18-450BZXC drop into a board designed for CY7C1570KV18-500BZC?

The two parts share the same 165-FBGA (13x15 mm) footprint, supply voltage range, and memory organization, so the board layout is compatible. The 450 MHz versus 500 MHz clock difference means the timing budget tightens if the board was originally routed for 500 MHz; verify signal integrity at the slower clock before committing.