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Cypress Semiconductor Corp CY7C1515KV18-333BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1515KV18-333BZXI SRAM, 72Mbit QDR II, 333 MHz

MPNCY7C1515KV18-333BZXI
Active

Infineon CY7C1515KV18-333BZXI, SRAM - Synchronous QDR II, 72Mbit (2M x 36), Parallel interface, 333 MHz, 1.7V~1.9V supply, -40°C to 85°C, 165-FBGA (13x15), Bulk.

$157.6000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1515KV18-333BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

Active lifecycle — no rush, but plan the BOM

No last-time-buy clock is ticking. That said, QDR II SRAM is a mature product family; Infineon hasn't flagged an EOL, but for long-run designs, locking in a second-source alternate or stocking a buffer against allocation shifts is prudent.

165-FBGA — rework reality

165-FBGA (13x15 mm) fine-pitch BGA. Requires reflow oven or BGA rework station with bottom heater. X-ray inspection needed after reflow.

Frequently asked questions

Will CY7C1515KV18-333BZXI drop into a board designed for CY7C1515KV18-250BZXI?

Yes, the two parts share the same 2M x 36 organization, 1.7V-1.9V supply, and 165-FBGA footprint. The 333 MHz part runs faster, so timing closure at the higher speed must be verified on the existing layout.

What is the package and temperature grade?

The part comes in a 165-FBGA (13x15 mm) surface-mount package and is rated for -40°C to 85°C industrial temperature range.