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AMD (Xilinx) ELANSC310-33KI — Microcontrollers & Processors (MCU / MPU / DSP)

Elan ELANSC310-33KI Am386SXLV MCU, 33 MHz, 208-PQFP

MPNELANSC310-33KI
End of Life

Elan Semiconductor, Am386SXLV series, 32-bit single-core MCU, ELANSC310-33KI, 33 MHz, ROMless external-memory architecture, 3 V supply, UART/USART, DMA, LCD, 208-pin PQFP, -40°C to 85°C.

$46.55Ref. price · indicative, final on quote
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Specifications

ELANSC310-33KI Technical Specifications
ParameterValue
Oscillator typeExternal, Internal
Program memory typeROMless
Mounting_typeSurface Mount
Operating temperature high-40°C to 85°C (TC)
Cpu_coreAm386®SXLV
Frame_size32-Bit Single-Core
Fuse_speed33 MHz
ConnectivityUART/USART
Package_typeBulk
Peripheral_typesDMA, LCD
Supply_voltage_v3

Product details

What this part is and where it fits

The Elan Semiconductor ELANSC310-33KI is a 32-bit single-core MCU built around the Am386SXLV core, clocked at 33 MHz. It is a ROMless device — all program and data storage must reside in external memory (Flash, EPROM, or SRAM) accessed over the external bus. On-chip peripherals include UART/USART, DMA, and an LCD controller, making it suited for embedded control panels, industrial terminals, and data-acquisition front-ends that need a legacy x86-class CPU with moderate throughput. The -40°C to 85°C temperature grade qualifies it for factory-floor and outdoor telecom environments.

33 MHz clock — what it means for the bus

At 33 MHz the external memory bus runs at the core clock; the ROMless architecture means every instruction fetch goes off-chip. This puts a premium on fast external Flash or SRAM to avoid wait-state penalties. Compared to the 25 MHz ELANSC310-25VC, the 33 MHz version delivers roughly 32% higher instruction throughput for the same memory latency — a meaningful gain for polling-heavy control loops or display refresh.

ROMless architecture — BOM planning note

Because the ELANSC310-33KI has no on-chip program memory, the BOM must include an external non-volatile memory device (parallel Flash or EPROM) plus a boot-time load mechanism if SRAM is used. The external bus width and timing must match the memory selected. Plan for a dedicated Flash footprint on the PCB; the DMA controller can handle block transfers from Flash to SRAM without CPU intervention.

Frequently asked questions

Will ELANSC310-33KI drop into a panel that was specified around ELANSC310-25VC?

The ELANSC310-33KI and ELANSC310-25VC share the same Am386SXLV core, package (208-pin PQFP), and peripheral set, but the 33 KI is rated for -40°C to 85°C versus the 25 VC's 0°C to 70°C, and runs at 33 MHz instead of 25 MHz. Mechanically the same footprint, but the temperature grade and timing must be verified against the existing design's thermal and bus-speed constraints before substitution.