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AMD (Xilinx) ELANSC310-25VC — Microcontrollers & Processors (MCU / MPU / DSP)

ELANSC310-25VC Am386SXLV 32-bit MCU, 25 MHz, ROMless, 208-TQFP

MPNELANSC310-25VC
End of Life

ELAN Microelectronics ELANSC310-25VC, 32-bit Am386SXLV single-core MCU, 25 MHz, ROMless, 3 V supply, UART/USART, DMA and LCD peripherals, surface-mount 208-TQFP, 0°C to 70°C ambient.

$41.74Ref. price · indicative, final on quote
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Specifications

ELANSC310-25VC Technical Specifications
ParameterValue
Oscillator typeExternal, Internal
Program memory typeROMless
Mounting_typeSurface Mount
Operating temperature high0°C to 70°C (TA)
Cpu_coreAm386®SXLV
Frame_size32-Bit Single-Core
Fuse_speed25 MHz
ConnectivityUART/USART
Package_typeBulk
Peripheral_typesDMA, LCD
Supply_voltage_v3

Product details

What this part is and where it fits

The ELANSC310-25VC is a 32-bit single-core microcontroller built around the Am386SXLV core, clocked at 25 MHz. It is ROMless — no on-chip program memory — so code must be fetched from an external Flash, EPROM, or SRAM via the external bus. The part integrates UART/USART serial connectivity, a DMA controller, and an LCD interface, and runs from a 3 V supply. It comes in a 208-pin TQFP for surface-mount assembly and is rated for 0°C to 70°C ambient, making it suited for indoor, climate-controlled equipment such as office automation, point-of-sale terminals, and embedded control panels where a 32-bit x86-class core is needed but the full PC chipset is not.

25 MHz clock — what it means for the bus

The 25 MHz core clock sets the external memory bus timing. Because the part is ROMless, the designer must pair it with an external memory device whose access time can meet the bus cycle at 25 MHz.

Temperature grade and environment

Rated for 0°C to 70°C ambient, this is a commercial-temperature part. It belongs in an indoor, conditioned environment — office equipment, retail terminals, or lab instrumentation. It is not rated for the -40°C to 85°C industrial range that the ELANSC310-33KI covers, so outdoor telecom cabinets, factory-floor controllers, or engine-bay modules are outside its guaranteed operating window.

ROMless design — BOM impact

With no on-chip program memory, the BOM must include an external boot device — typically a parallel NOR Flash or an EPROM. That adds board area, a second supply rail if the memory runs at a different voltage, and a bus-timing closure exercise. The 3 V supply helps keep overall power low, but the external memory will dominate standby current. For a production run, the ROMless architecture also means the firmware image must be pre-loaded into the external memory, adding a programming step to the assembly flow.

Frequently asked questions

Will the ELANSC310-25VC drop into a panel specified around the ELANSC310-33KI?

The pinout is identical, so the 25 VC will physically fit a board laid out for the 33 KI. However, the 25 VC runs at 25 MHz instead of 33 MHz, so the system clock and any timing-dependent firmware (baud rates, bus cycles) must be reconfigured. The temperature range is also narrower (0°C to 70°C vs -40°C to 85°C), so the environment must be verified.