25 ns PAL with 10 macrocells — 5 V glue-logic fit
The AMD (Xilinx) AMPAL22P10ALJC is a PAL-type OTP PLD with a propagation delay of 25 ns, giving it a ceiling around 40 MHz for registered logic. It integrates 10 macrocells, enough to absorb a handful of 5 V glue-logic equations — address decoding, state-machine sequencing, or bus handshake — that would otherwise consume multiple 74-series packages. The 28-PLCC (J-Lead) package with a 11.51 mm x 11.51 mm body and 1.27 mm pitch mounts on a standard PLCC-28 footprint.
Active production — RoHS non-compliant
Note that this part is RoHS non-compliant (lead-bearing solder balls/terminations). It is intended for applications where lead-free exemption applies — military, aerospace, or medical equipment with a legacy solder process. For RoHS-required builds, a tin-lead alternative or a waiver is needed.
Package and board-level integration
The 28-LCC (J-Lead) package is surface-mount with a J-bend lead form, seated height approximately 3.5 mm. The PLCC-28 footprint is standard: a 0.100-inch (2.54 mm) pitch on the outer rows, with the centre pad floating (not grounded). The J-lead provides a compliant joint for thermal cycling, and the package is socketable in a PLCC-28 socket if field replacement is anticipated. Decoupling: place a 0.1 µF ceramic capacitor within 5 mm of each VCC pin (pins 2 and 27 on the PLCC-28) to ground. The 5 V supply rail should be clean to within 100 mV peak-to-peak; the 4.75-5.25 V range gives 250 mV of margin on the low side.