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AMD (Xilinx) AM27S191/BUA — Memory (DRAM / SRAM / Flash / EEPROM)
AMD (Xilinx)

AMD AM27S191/BUA PROM 16Kbit, 65 ns, 32-CLCC

MPNAM27S191/BUA
End of Life

AMD AM27S191/BUA, 16Kbit non-volatile PROM, 2K x 8 parallel organization, 65 ns access time, 4.5 V supply, 32-CLCC ceramic leadless chip carrier, -55°C to 125°C operating range.

$48.61Ref. price · indicative, final on quote
AM27S191/BUA datasheet
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Specifications

AM27S191/BUA Technical Specifications
ParameterValue
Interface_typeParallel
Mounting_typeSurface Mount
Operating temperature high-55°C to 125°C (TC)
Frame_size16Kbit
Access time65 ns
Memory_typeNon-Volatile
Package_typeBulk
Memory formatPROM
Supply_voltage_v4.5
Memory organization2K x 8

Product details

What this PROM is and where it fits

The AMD AM27S191/BUA is a 16Kbit non-volatile PROM organized as 2K x 8 bits, accessed over a parallel interface in a 32-CLCC ceramic leadless chip carrier. It runs on a 4.5 V supply and delivers a 65 ns access time, which puts it squarely in the mid-speed range for legacy bipolar PROMs. The ceramic hermetic package and -55°C to 125°C military temperature range mean this part was built for avionics, missile guidance, satellite, or downhole tooling — environments where a plastic package won't hold up.

Ceramic CLCC — why the package matters

The 32-CLCC is a hermetic ceramic leadless chip carrier. No plastic, no epoxy — it's a sealed cavity that keeps moisture and contaminants out. That's why it carries the full -55°C to 125°C range. If your board lives in a sealed avionics box or a downhole tool that sees thermal cycling and vibration, this package is the right call. It's surface-mount, so reflow profiles need to match the ceramic body's thermal mass — no lead forming, no socket required unless the design calls for one.

Frequently asked questions

What is the closest functional second-source for the AM27S191/BUA?

The closest functional sibling is the AM27S191SA/BKA, which shares the same 16Kbit density, 2K x 8 organization, 4.5 V supply, and military temperature range, but offers a faster 30 ns access time. It is not a guaranteed drop-in replacement — verify the package footprint (BKA suffix) against the BUA before substituting.

Will the AM27S191/BUA drop into a board designed for the AM27S191SA/BKA?

Both parts share the same 16Kbit PROM core, 2K x 8 organization, and 4.5 V supply, but the BUA and BKA suffixes indicate different package variants. The BUA is a 32-CLCC; the BKA is also a 32-lead ceramic package but the exact footprint and pinout should be verified against the board layout before assuming interchangeability.