MSP430F67781IPZ — MSP430F6xx 512KB Flash 25MHz MCU with Sigma-Delta AFE
Texas Instruments MSP430F67781IPZ, MSP430F6xx series, 16-bit MCU with 512KB Flash / 16KB SRAM, 25MHz MSP430 CPUXV2 core, 7×24-bit sigma-delta A/D plus 8×10-bit SAR, 62 I/O, I²C/SPI/UART/LINbus/IrDA, internal oscillator, 1.8–3.6V supply, -40°C to 85°C, 100-LQFP tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | MSP430F6xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 25MHz |
| Package | Tray |
| RAM size | 16K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter |
| Connectivity | I²C, IrDA, LINbus, SPI, UART/USART |
| Number of i (O) | 62 |
| Core processor | MSP430 CPUXV2 |
| Case | 100-LQFP |
| Data converters | A/D 8x10b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
Is there a pin-compatible or firmware-compatible substitute for the MSP430F67781IPZ?
The MSP430F67781IPZ shares its die spin and package footprint within the MSP430F677x1A sub-family — a TI cross-reference listing is the authoritative source for footprint-compatible variants. DMA channel assignments and peripheral register maps shift between die spins; firmware binary compatibility cannot be assumed from package and pin count alone. An official TI cross-reference order code must be confirmed before selecting an alternate for a BOM substitution.
What does the tray packaging mean for shelf life and reflow solderability?
The MSP430F67781IPZ ships in tray — not reel or cut-tape. Once broken from the original dry-pack reel to tray, moisture exposure tracking is the user's responsibility. Confirm the MSL rating from the TI datasheet for this package and apply the JEDEC J-STD-033 bake schedule if the part has been stored above the rated humidity threshold or beyond its exposure time limit at assembly ambient.