Skip to main content
Renesas Electronics R5F572TKFGFP#30 — Microcontrollers & Processors (MCU / MPU / DSP)

R5F572TKFGFP#30 Renesas RX700 MCU, 200 MHz, 1 MB Flash

MPNR5F572TKFGFP#30
End of Life

Renesas Electronics RX700 series 32-bit single-core MCU, RXv3 core, 200 MHz, 1 MB FLASH, 128 KB RAM, 32 KB EEPROM, 100-LQFP, -40°C to 105°C.

$14.1Ref. price · indicative, final on quote
Packaging100-LQFP
RoHSROHS3 Compliant
SeriesRX700
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

R5F572TKFGFP#30 specifications
ParameterValue
SeriesRX700
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 5.5V
Operating temperature-40°C ~ 105°C (TA)
Speed200MHz
PackageTray
RAM size128K x 8
Core size32-Bit Single-Core
EEPROM size32K x 8
PeripheralsDMA, LVD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI
Number of i (O)73
Core processorRXv3
Case100-LQFP
Data convertersA/D 22x12b; D/A 2x12b
Program memory size1MB (1M x 8)

Product details

200 MHz RXv3 core for real-time control loops

The R5F572TKFGFP#30 is a 32-bit single-core MCU from the Renesas RX700 series, built around the RXv3 core running at 200 MHz. This clock rate sets the throughput ceiling for time-critical tasks like servo-loop closure or fieldbus cycle processing — the 225 DMIPS-class core can execute a PID update and a CAN message parse within a single 100 µs control tick. The 1 MB on-chip flash (1M x 8) and 128 KB RAM (128K x 8) partition cleanly for a real-time operating system, application stack, and data buffers. An additional 32 KB EEPROM (32K x 8) holds calibration constants and configuration parameters without needing an external serial EEPROM — one fewer BOM line for non-volatile storage.

Industrial temperature grade and supply flexibility

The 100-LQFP package (also supplied as 100-LFQFP, 14x14 mm) has a 0.50 mm pitch. Routing all 73 I/O plus the EBI/EMI bus on a two-layer board is tight — a 4-layer stack-up with a solid ground plane under the BGA-equivalent fan-out region is the practical minimum for signal integrity at 200 MHz.

Peripheral set for a fieldbus gateway or multi-axis controller

Connectivity includes Ethernet, CAN, QSPI, SCI (UART), I²C, SSI, and an EBI/EMI bus for external memory or FPGA attachment. The MMC/SD interface logs data directly to a removable card. This combination suits a single-chip gateway that bridges a CANopen fieldbus to an Ethernet-based SCADA network. The 22-channel 12-bit ADC and 2-channel 12-bit DAC provide enough analog front-end for three-phase current sensing (two shunt resistors plus a DC-link voltage) and one analog output on a servo drive. DMA, LVD, POR, PWM, and WDT peripherals are integrated — the PWM timers can generate complementary dead-time-controlled outputs for a three-phase inverter.