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Renesas Electronics R5F56517BGFB#30 — Microcontrollers & Processors (MCU / MPU / DSP)

R5F56517BGFB#30 Renesas RX651 MCU 32-bit 120 MHz 768KB Flash

MPNR5F56517BGFB#30
End of Life

Renesas Electronics RX651 series, 32-bit RXv2 core MCU, 120 MHz, 768 KB flash, 256 KB RAM, 111 I/O, 144-LQFP, -40°C to 105°C, active production, ROHS3 compliant.

$7.66Ref. price · indicative, final on quote
Packaging144-LQFP
RoHSROHS3 Compliant
SeriesRX651
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

R5F56517BGFB#30 specifications
ParameterValue
SeriesRX651
MountingSurface Mount
Oscillator typeExternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed120MHz
PackageTray
RAM size256K x 8
Core size32-Bit
PeripheralsDMA, LVD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Number of i (O)111
Core processorRXv2
Case144-LQFP
Data convertersA/D 29x12b; D/A 2x12b
Program memory size768KB (768K x 8)

Product details

RXv2 core at 120 MHz — what it buys on the board

The R5F56517BGFB#30 is a 32-bit RXv2 MCU clocked at 120 MHz, with 768 KB of flash and 256 KB of RAM on a single die. That clock and memory envelope handles a real-time control loop plus a TCP/IP stack without external memory — the 256 KB SRAM leaves room for packet buffers and the application heap after the RTOS footprint.

111 I/O lines in a 144-LQFP package give you enough pins to keep a legacy 100-pin sensor array or motor-drive interface without a CPLD. On-chip Ethernet, USB, CAN, and QSPI mean the board can talk to a plant network and a local HMI with one MCU — no external PHY for the Ethernet MAC, and the USB interface handles device or host mode.

Temperature range and supply — industrial fit

Lifecycle status is Active — no end-of-life notice, no successor forced on the BOM yet.

144-LQFP with 0.5 mm pitch — a standard fine-pitch QFP that a rework station can handle with a hot-air nozzle and a stencil. No BGA reball, no X-ray inspection. The 20x20 mm body fits a two-layer board if you route the outer rows first; inner rows need a four-layer stack-up for clean fan-out.

Frequently asked questions

Where can I find the datasheet for R5F56517BGFB#30?

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Is R5F56517BGFB#30 available in stock?

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What is the equivalent or replacement for R5F56517BGFB#30?

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Does R5F56517BGFB#30 have Ethernet and USB connectivity?

Connectivity options are critical for networking and IoT application decisions.

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