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Renesas Electronics R5F1006AGSM#30 — Microcontrollers & Processors (MCU / MPU / DSP)

R5F1006AGSM#30 Renesas RL78/G13 16-bit MCU, 32 MHz

MPNR5F1006AGSM#30
End of Life

Renesas RL78/G13 16-bit MCU, R5F1006AGSM#30, 32MHz, 16KB Flash, 2K x 8 RAM, 4K x 8 EEPROM, 20-TSSOP, -40 to 105°C, 2.4 to 5.5V.

$1.41Ref. price · indicative, final on quote
Packaging20-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesRL78/G13
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

R5F1006AGSM#30 specifications
ParameterValue
SeriesRL78/G13
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.4V ~ 5.5V
Operating temperature-40°C ~ 105°C (TA)
Speed32MHz
PackageTray
RAM size2K x 8
Core size16-Bit
EEPROM size4K x 8
PeripheralsDMA, LVD, POR, PWM, WDT
ConnectivityCSI, I²C, SPI, UART/USART
Number of i (O)13
Core processorRL78
Case20-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 6x8/10b
Program memory size16KB (16K x 8)

Product details

32 MHz 16-bit MCU for industrial sensor and control applications

The Renesas R5F1006AGSM#30 is a 16-bit RL78/G13 microcontroller clocked at 32 MHz, built around the RL78 core. The part operates across a wide supply range of 2.4 V to 5.5 V and is rated for industrial environments from -40°C to 105°C, so it can sit in an outdoor telecom cabinet or a factory-floor motor drive without derating.

Peripheral set and I/O — what you get in 13 pins

On-chip peripherals include a DMA controller for background data moves, a low-voltage detector (LVD) and power-on reset (POR) for reliable startup, a PWM timer for motor or LED drive, and a watchdog timer (WDT) for safety-critical loops. Communication interfaces cover CSI (clocked serial), I²C, SPI, and UART/USART — enough to talk to a temperature sensor, an EEPROM, and a host controller on a single chip. The A/D converter offers up to six channels with 8- or 10-bit resolution, suitable for reading potentiometers, thermistors, or current-sense resistors.

Lifecycle and sourcing — active part, no obsolescence risk

The part is ROHS3 compliant.

Package and footprint — 20-TSSOP, surface-mount assembly

The MCU comes in a 20-TSSOP package (4.40 mm body width, 0.65 mm pitch), designated as supplier device package 20-TSSOP. It is a surface-mount device intended for reflow soldering.

Frequently asked questions

What is the difference between R5F1006AGSM#30 and R5F1006AGSP#30?

The suffix difference (#30 vs #SP) typically indicates packaging or shipping medium (tray vs tape-and-reel). The core MCU die, memory map, and electrical ratings are identical. If your pick-and-place line requires reel feed, confirm the #SP variant; for tray-loaded hand-assembly or small-batch runs, the #30 tray variant works.

Can R5F1006AGSM#30 replace R5F1006AGSP#30?

Yes, the two share the same RL78/G13 die, speed, memory, and temperature grade. The only difference is the shipping medium (tray vs tape-and-reel). For board-level fit, they are interchangeable as long as your assembly process accepts tray-fed parts.