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Renesas Electronics AT45DB021E-MHN-Y — DC-DC Power Modules

AT45DB021E-MHN-Y 2Mbit SPI Flash, 70 MHz, 8-UDFN

MPNAT45DB021E-MHN-Y
End of Life

Adesto AT45DB021E-MHN-Y, 2Mbit SPI serial flash, 70 MHz clock, 1.65V-3.6V supply, 264 Bytes x 1024 pages, -40°C to 85°C, 8-UDFN (5x6) exposed pad, Tray.

$1.51Ref. price · indicative, final on quote
Packaging8-UDFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

AT45DB021E-MHN-Y Technical Specifications
ParameterValue
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage1.65V ~ 3.6V
Frequency70 MHz
Memory interfaceSPI
Operating temperature-40°C ~ 85°C (TC)
PackageTray
TechnologyFLASH
Memory size2Mbit
Memory formatFLASH
Case8-UDFN Exposed Pad
Memory organization264 Bytes x 1024 pages
Write cycle time - word, page8µs, 3ms

Product details

2 Mbit serial flash with a wide voltage range

The Adesto AT45DB021E-MHN-Y is a 2 Mbit SPI serial flash memory built for designs that need non-volatile storage with a simple 4-wire interface. It clocks at 70 MHz over SPI, which gives you a read throughput around 8 MB/s — enough for code shadowing, configuration tables, or small data logs. The supply range from 1.65 V to 3.6 V means it plays nicely on both 1.8 V and 3.3 V rails without a level translator, a real BOM simplifier in mixed-voltage systems. Internally the array is organized as 264 bytes per page across 1024 pages, a classic DataFlash page layout that suits small-block reads and writes. Page write time is 3 ms, and a single byte or word can be written in 8 µs — handy for updating a calibration constant without erasing the whole page. The operating temperature range of -40°C to 85°C qualifies it for industrial environments — think outdoor telecom, motor drives, or factory automation panels. It's rated for surface-mount assembly in an 8-UDFN package with an exposed pad (5x6 mm), which helps thermal dissipation but needs a thermal via stitch under the pad for continuous writes at high ambient.

Package and footprint — what to watch

The 8-UDFN (5x6) exposed-pad package is hand-solderable with a fine-tip iron and some flux, but the exposed pad is the main thermal path. On a two-layer board, stitch at least four vias from the pad to a ground plane pour; on four-layer, a solid via array under the pad keeps junction temperature under control during back-to-back page writes. The part ships in a Tray — if your pick-and-place line feeds from tape, the -T suffix variant (AT45DB021E-MHN-T) is the reeled version with identical silicon.

Lifecycle and sourcing

The AT45DB021E-MHN-Y carries an Active lifecycle status with ROHS3 compliance. For dual-sourcing flexibility, the same die is available in a wider SOIC package (AT45DB021E-SSHN-B in tube, AT45DB021E-SSHN-T on tape) — same 2 Mbit, same 70 MHz SPI, same temperature grade, different footprint.

Frequently asked questions

Can AT45DB021E-MHN-Y replace AT45DB021E-MHN?

The AT45DB021E-MHN-Y is functionally identical to the AT45DB021E-MHN-T — same 2 Mbit density, 70 MHz SPI, and 8-UDFN package. The -Y suffix indicates Tray shipping; the -T suffix is Tape & Reel. Silicon and performance are the same.