20-TSSOP footprint and board integration
The 74FCT245CTPGG comes in a 20-TSSOP package with a 0.173-inch (4.40 mm) body width — a compact footprint for bus transceiver functions on dense PCBs. The 0.65 mm pitch demands a fine-pitch solder paste stencil; typical land pattern follows JEDEC MO-153 for TSSOP-20. The 15 mA source / 64 mA sink output drive handles standard TTL loads and lightly loaded backplanes.
