The 71V016SA10BF is a 1Mbit asynchronous SRAM organized as 64K x 16 with a parallel interface. Access time is 10 ns.
BGA footprint — layout and rework notes
The 48-CABGA (7x7 mm) package uses a 0.8 mm ball pitch. That's tight enough that you'll want via-in-pad or microvias under the BGA for the inner rows, and a solder mask defined pad. The part is surface mount only. For rework, expect to pre-bake the board if the moisture-sensitive level (MSL) floor life has been exceeded — typical for BGA packages.
