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Renesas Electronics 14235R-2000 — Analog & Data Acquisition

Renesas 14235R-2000 LONWORKS Smart Transceiver, 64Kx8 RAM

MPN14235R-2000
End of Life

Renesas Electronics LONWORKS® Smart Transceiver, 14235R-2000, Neuron core, 64K x 8 RAM, I2C, SPI, 3V-3.6V, -40°C-85°C, 48-VFQFN Exposed Pad, Surface Mount.

$19.88Ref. price · indicative, final on quote
Packaging48-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesLONWORKS®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

14235R-2000 specifications
ParameterValue
SeriesLONWORKS®
MountingSurface Mount
Program memory typeExternal Program Memory
Voltage3V ~ 3.6V
InterfaceI2C, SPI
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
RAM size64K x 8
ApplicationsSmart Transceiver
Number of i (O)12
Core processorNeuron
Case48-VFQFN Exposed Pad

Product details

What the 14235R-2000 is and where it fits

The Renesas 14235R-2000 is a LONWORKS Smart Transceiver built around a Neuron core processor with 64K x 8 of on-chip RAM. It targets control-network endpoints — building automation, lighting, HVAC, and industrial sensor nodes — where the LONWORKS protocol handles peer-to-peer communication across twisted-pair, powerline, or RF media. The transceiver integrates the Neuron firmware and network stack, so the host MCU offloads LonTalk protocol processing; the 12 general-purpose I/O lines handle local sensor/actuator interface without glue logic.

Memory, interfaces, and program storage

64K x 8 of RAM supports the network buffer pool and application variables — enough for a medium-sized LonMark object profile with several network variables and configuration properties. The device uses external program memory, so the firmware image lives in a separate serial flash or EEPROM; the I2C and SPI interfaces connect directly to the memory device without a separate address/data bus. I2C and SPI also serve auxiliary peripherals — a temperature sensor, an ADC, or a digital potentiometer — sharing the same bus without extra port pins.

Supply, temperature, and package details for board integration

Surface-mount assembly with the exposed pad means the reflow profile must follow the QFN solder-paste stencil guidelines; the centre pad voiding target is under 25 % per IPC-7093.

ROHS3 compliance covers the ten restricted substances including the four phthalates; no exemption declarations are needed for EU-market equipment.