Skip to main content

NXP Semiconductors TEA1 Dc Dc Modules Series

2 variants · NXP Semiconductors

About the NXP Semiconductors TEA1 Dc Dc Modules Series

The NXP Semiconductors TEA1 Dc Dc Modules Series series groups 2 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common mounting of Surface Mount and package of Tape & Reel (TR); Cut Tape (CT). Variants differ by case and operating temperature, so you can match the exact case your application requires using the selection guide below. All listed NXP Semiconductors TEA1 Dc Dc Modules Series part numbers are active and orderable.

Select a variant by

Case
8-SOIC (0.154\", 3.90mm Width), 7 Leads · 14-SOIC (0.154\", 3.90mm Width)
Operating temperature
-40°C ~ 85°C (TA) · -20°C ~ 150°C

Shared specifications

Mounting
Surface Mount
Package
Tape & Reel (TR); Cut Tape (CT)

Variant comparison

ParameterTEA1723BT/N1,118TEA1762T/N2/DG,118
Case8-SOIC (0.154\", 3.90mm Width), 7 Leads14-SOIC (0.154\", 3.90mm Width)
Operating temperature-40°C ~ 85°C (TA)-20°C ~ 150°C

Request a quote on any NXP Semiconductors TEA1 Dc Dc Modules Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants