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NXP USA Inc. MKL17Z32VDA4R — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MKL17Z32VDA4R Kinetis KL1 MCU, 48MHz Cortex-M0+, 32KB Flash

MPNMKL17Z32VDA4R
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NXP Kinetis KL1 series 32-bit ARM Cortex-M0+ MCU, MKL17Z32VDA4R, 48MHz, 32KB FLASH, 8KB RAM, 1.71V-3.6V supply, -40 to 105°C, 36-XFBGA (3.5x3.5mm).

$6.3900Ref. price · indicative, final on quote
NXP USA Inc. MKL17Z32VDA4R datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MKL17Z32VDA4R specifications
ParameterValue
SeriesKinetis KL1
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed48MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size8K x 8
Core size32-Bit Single-Core
PeripheralsDMA, I²S, PWM, WDT
ConnectivityI²C, FlexIO, SPI, UART/USART
Number of i (O)32
Core processorARM® Cortex®-M0+
Case36-XFBGA
Data convertersA/D 15x16b
Program memory size32KB (32K x 8)

Product details

48 MHz Cortex-M0+ in a 3.5 mm square

The NXP MKL17Z32VDA4R is a 32-bit ARM Cortex-M0+ MCU from the Kinetis KL1 series, clocked at 48 MHz with 32 KB Flash and 8 KB RAM. It runs on a 1.71 V to 3.6 V supply and is rated for -40 to 105 °C, which puts it in the industrial-temperature bracket — usable in outdoor telecom cabinets, engine-bay sensor nodes, or factory-floor I/O modules without a heater or fan. The 36-XFBGA package measures 3.5 x 3.5 mm, so the board real estate is tight; plan for micro-vias and a controlled-impedance stack if you route the FlexIO or SPI traces at speed.

Peripherals and I/O for sensor-fusion designs

The 32 I/O lines include a 15-channel 16-bit ADC. DMA and PWM are on the peripheral list.

Rework reality on the 36-XFBGA

The 36-XFBGA is a 3.5 x 3.5 mm fine-pitch BGA. Verify orientation under magnification before placement.

Frequently asked questions

What is the operating temperature range of MKL17Z32VDA4R?

The MKL17Z32VDA4R is rated for -40 to 105 °C, which qualifies it for industrial and automotive under-hood environments without active cooling.

What is the difference between MKL17Z32VDA4R and MKL17Z64VDA4R?

The difference is program memory size: the MKL17Z32VDA4R has 32 KB Flash, while the MKL17Z64VDA4R has 64 KB Flash. Both share the same 36-XFBGA package, 48 MHz core, and peripheral set, so firmware size is the deciding factor for the BOM line.

Is MKL17Z32VDA4R RoHS compliant?

The MKL17Z32VDA4R is supplied in a Tape & Reel package consistent with RoHS-compliant NXP Kinetis production. Verify the specific date-code certificate at order time if compliance documentation is required for your quality system.